2026-08-20+00:0015:03:03+00:00RES-0001TEN-0001CON-0001LOT-0000TEN-0001199900TPA-0001LOT-000010921 – Blade Dicing SawCON-000110921 – Blade Dicing SawTEN-0001TPA-0001ORG-000425https://www.dtu.dkORG-0001Danmarks Tekniske Universitet - DTUAnker Engelunds Vej 1Kgs. Lyngby2800DK012DNK30060946Andrea Albert+45 93511466aalb@dtu.dkhttp://www.klfu.dkORG-0002Klagenævnet for UdbudNævnenes hus, Toldboden 2Viborg8800DK042DNK37795526+45 35291000klfu@erst.dkhttp://www.kfst.dkORG-0003Konkurrence- og ForbrugerstyrelsenCarl Jacobsens Vej 35Valby2500DK011DNK10294819+45 41715000kfst@kfst.dkORG-0004DISCO HI-TEC EUROPE GmbHKirchheim b. Munchen85551DE21HDEUhttp://mercell.com/ORG-0005Mercell Holding ASAAskekroken 11Oslo0277NO081NOR980921565eSender+47 21018800+47 21018801publication@mercell.com00581505-2026162/20262026-08-24+02:002.3eforms-sdk-1.13ab86474e-d86a-4964-80e4-fe6e2077078b81c47151-8eea-42ac-a9f0-57bb9fab12402026-08-20+00:0014:00:56+00:000132014L0024veatDANhttps://eu.eu-supply.com/ctm/company/companyinformation/index/165863body-pleducationORG-0001ted-esenORG-0005neg-wo-calltechnicalDTU Nanolab has a documented need for a dicing system capable of: - Processing wafers up to 300 mm diameter; - Performing conventional wafer dicing; - Performing circular cutting of wafers; - Performing edge trimming of circularly cut wafers in order to improve the mechanical strength and handling robustness of the processed wafers; and - Supporting these operations within one integrated production platform suitable for a multi-user cleanroom environment. A market assessment has been conducted to identify suppliers capable of fulfilling the above technical requirements. The assessment included a review of solutions available from DISCO Corporation and Accretech, which are among the established suppliers of advanced wafer dicing equipment for semiconductor and microfabrication applications. The market assessment showed that alternative solutions can perform standard wafer dicing and, in some cases, processing of wafers larger than 200 mm. However, DTU Nanolab has not identified any alternative supplier capable of providing a commercially available system that combines all mandatory requirements, including both circular wafer cutting and subsequent edge trimming within the same equipment platform. The capability to perform circular cutting and edge trimming is an essential technical requirement arising from DTU Nanolab's user needs and research activities. These functions are necessary to enable preparation of circular substrates and strengthening of cut wafer edges prior to subsequent processing and handling. The requirement is therefore linked to the intended use of the equipment and has not been defined with the purpose of favouring a specific supplier. Based on the market assessment, DISCO Corporation's DAD3361 is the only identified solution currently available on the market that fulfils all mandatory technical requirements. Consequently, competition is absent for technical reasons, and there is no reasonable alternative or substitute capable of meeting DTU Nanolab's requirements. The direct award is therefore considered justified on the basis of lack of competition for technical reasons. For completeness, it should be noted that operation of the equipment alongside DTU Nanolab's existing DISCO DAD3241 platform provides additional operational benefits, including streamlined training, maintenance and process management. However, these considerations are supplementary and are not the basis for the direct award. The direct award is based solely on the conclusion that no other identified supplier can fulfil the mandatory technical requirements described above.10921Blade Dicing SawDTU Nanolab intends to procure a semi-automatic wafer dicing system for research and cleanroom operations. The equipment must be capable of processing wafers up to 300 mm diameter and support conventional wafer dicing, circular wafer cutting, multi-circular cutting, and edge trimming of circularly cut wafers to improve mechanical strength and handling robustness. The system must also be capable of processing hard and thick materials used in advanced microfabrication and semiconductor research, including materials such as silicon carbide (SiC) and piezoelectric substrates. The equipment will be installed and operated in DTU Nanolab's multi-user cleanroom environment and will support research, innovation, and industrial collaboration activities.supplies38000000anywLOT-0000ORG-0001ORG-0002ORG-0003true10921Blade Dicing SawDTU Nanolab intends to procure a semi-automatic wafer dicing system for research and cleanroom operations. The equipment must be capable of processing wafers up to 300 mm diameter and support conventional wafer dicing, circular wafer cutting, multi-circular cutting, and edge trimming of circularly cut wafers to improve mechanical strength and handling robustness. The system must also be capable of processing hard and thick materials used in advanced microfabrication and semiconductor research, including materials such as silicon carbide (SiC) and piezoelectric substrates. The equipment will be installed and operated in DTU Nanolab's multi-user cleanroom environment and will support research, innovation, and industrial collaboration activities.supplies38000000anyw2000-01-01Z