595e0aca-da98-46f7-ad1b-9f2972c2a64e-01 Maximum renewals has been modified LOT-0001 update-add Maximum renewals has been modified 16 ORG-0001 Uppsala universitet Dag Hammarskjölds Väg 7 Uppsala 752 37 SE121 SWE 202100-2932 018-471 00 00 info@uu.se https://www.e-avrop.com ORG-0002 Antirio AB GÅRDSVÄGEN 18 Solna 169 70 SE110 SWE 556533-8133 08-501 190 00 support@e-avrop.com https://www.domstol.se/forvaltningsratten-i-uppsala/ ORG-0003 Förvaltningsrätten i Uppsala Box 1853 Uppsala 751 48 SE121 SWE 202100-2742 +46 18-431 63 00 forvaltningsratteniuppsala@dom.se 00700865-2026197/20262026-10-12+02:00 2.3 eforms-sdk-1.13 595e0aca-da98-46f7-ad1b-9f2972c2a64e af31bec1-a9e7-474a-ac38-3652b7cf2461 2026-10-09+02:00 14:14:24+02:00 02 32014L0024 cn-standard ENG cga education ORG-0001 ted-esen ORG-0002 epo-procurement-document open false Deep Reaction Ion Etcher (DRIE) Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning. supplies 1 42000000 SE121 SWE LOT-0001 no-eu-funds 1 non-restricted-document https://www.e-avrop.com/uppsalauniv/e-Upphandling/NoticeLink.aspx?id=120368 false epo-procurement-document none not-allowed required no ORG-0001 https://www.e-avrop.com/uppsalauniv/e-Upphandling/NoticeLink.aspx?id=120368 3 ORG-0003 ORG-0003 ENG false true allowed true 2026-11-10+01:00 00:00:00+01:00 false none none urn:eavrop:mdn:ProcurementProject:121377:Lot:1 Deep Reaction Ion Etcher (DRIE) Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning. supplies none 42000000 SE121 SWE 2026-12-15+01:00 2037-12-14+01:00 Service agreement, updates, upgrades, accessories, and add-on functionalities. 8 Up to 12 months per extension period