2026-10-08+00:0015:00:48+00:0016https://www.dtu.dkORG-0001Danmarks Tekniske Universitet - DTUAnker Engelunds Vej 1Kgs. Lyngby2800DK012DNK30060946Mikkel Taanum+45 20133820miktaa@dtu.dkhttp://www.klfu.dkORG-0002Klagenævnet for UdbudNævnenes hus, Toldboden 2Viborg8800DK042DNK37795526+45 35291000klfu@erst.dkhttp://www.kfst.dkORG-0003Konkurrence- og ForbrugerstyrelsenCarl Jacobsens Vej 35Valby2500DK011DNK10294819+45 41715000kfst@kfst.dkhttp://mercell.com/ORG-0004Mercell Holding ASAAskekroken 11Oslo0277NO081NOR980921565eSender+47 21018800+47 21018801publication@mercell.com00701524-2026197/20262026-10-12+02:002.3eforms-sdk-1.130a646b33-68e6-4139-9a0c-af6045862a0e4cf047fd-3866-417b-83e5-e27ebe5bf4452026-10-08+00:0015:00:48+00:000132014L0024cn-standardENGhttps://eu.eu-supply.com/ctm/company/companyinformation/index/165863body-pleducationORG-0001ted-esenORG-0004epo-sub-espdopenfalse10527Delivery and installation of a ICP Reactive ion etcher for silicon dielctricsDTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides and nitrides of silicon to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q3 2027. The Instrument will be installed in the DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro- and nanofabrication tools. It serves a diverse community of over 200 active users, ranging from novice students to experienced researchers, as well a high percentage of commercial clients. As an open access tool, the Instrument must support the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures defined by electron beam lithography to depths of several tens of microns. Meeting these demands requires exceptional process controllability and tunability: the system must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight sidewalls and minimal undercut for shallow features, alongside high etch rate deep etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all these masking materials. The user interface must be intuitive and user friendly. The Instrument should be engineered to the highest industrial standards to minimize maintenance, and any required servicing must be straightforward and efficient. The instrument must be configured for 150 mm wafer processing and a complete kit enabling the processing of 200 mm wafers must be included in the tender as an option. Furthermore, DTU will have the option to purchase one more ICP Reactive ion etcher for silicon dielctrics identical to the initial instrument.suppliesservices4200000038636110Technical University of Denmark, NanoLab, Ørsted Plads, Building 346Kgs. Lyngby2800DK012DNKLOT-0000falsefalsenot-allowedno-eu-fundsfalsenot-allowedtrueIf the supplier wishes pre-payment any such pre-payment will have to be backed by a bank guarantee. Please see draft contract.ENG10527non-restricted-documenthttps://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=459779&TID=200420246&B=noneepo-sub-espdfalserequiredfalsenonot-allowedfalseper-exa20pricePriceThe price for the instrumentper-exa50qualityFunctionality and performanceThe functionality and performance of the tender, based on the tenderers response to appendix 1.per-exa30qualityQuality of submitted samplesThe quality of submitted samples, as described in appendix 1ORG-0001https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=459779&TID=200420246&B=ORG-0001ORG-00016Complaint regarding the award of a contract must be submitted no later than 45 calendar days from the date after the Contracting Authority has published a notice in the European Union Official Journal informing that the Contracting Authority has awarded/concluded a contract, cf. lov om Klagenævnet for Udbud (Complaints Board for Tenders) § 7, Section 2, no. 1.ORG-0003ORG-0002ENGfalsetruefalserequiredtrue2026-11-23+00:0022:55:00+00:002026-11-12+00:0022:55:00+00:00falsenonenone10527Delivery and installation of a ICP Reactive ion etcher for silicon dielctricsDTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides and nitrides of silicon to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q3 2027. The Instrument will be installed in the DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro- and nanofabrication tools. It serves a diverse community of over 200 active users, ranging from novice students to experienced researchers, as well a high percentage of commercial clients. As an open access tool, the Instrument must support the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures defined by electron beam lithography to depths of several tens of microns. Meeting these demands requires exceptional process controllability and tunability: the system must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight sidewalls and minimal undercut for shallow features, alongside high etch rate deep etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all these masking materials. The user interface must be intuitive and user friendly. The Instrument should be engineered to the highest industrial standards to minimize maintenance, and any required servicing must be straightforward and efficient. The instrument must be configured for 150 mm wafer processing and a complete kit enabling the processing of 200 mm wafers must be included in the tender as an option. Furthermore, DTU will have the option to purchase one more ICP Reactive ion etcher for silicon dielctrics identical to the initial instrument.suppliestrueservices4200000038636110Technical University of Denmark, NanoLab, Ørsted Plads, Building 346Kgs. Lyngby2800DK012DNKUNKNOWNThere will be an option for an upgrade kit to 200 mm wafers for the instrument and an option for one further identical instrument.