2024-04-05+00:0010:02:27+00:00dd160720-6f33-4ba3-beff-8f5724f69541-01LOT-000016https://www.utwente.nlORG-0001Universiteit TwenteUniversity of TwenteDrienerlolaan 5Enschede7522NBNLD50130536Camilio Delfgaauw+31534891512c.delfgaauw@utwente.nlORG-0002Rechtbank OverijsselRechtbank OverijsselAlmeloNLD82940525(+31)0883611042communicatie.rb-ove@rechtspraak.nl00204548-202469/20242024-04-08Z2.3eforms-sdk-1.705a9cacd-c796-4b89-98ef-753ce3507da5348b966a-a429-4771-bd3e-da06e394a3862024-04-05+00:0010:01:45+00:000232014L0024cn-standardNLDENGhttps://s2c.mercell.com/buyer/16033body-pleducationORG-0001corruptionSee descriptive documentZie beschrijvend documentcrime-orgSee descriptive documentZie beschrijvend documentfinan-laundSee descriptive documentZie beschrijvend documentfraudSee descriptive documentZie beschrijvend documenthuman-trafficSee descriptive documentZie beschrijvend documentterr-offenceSee descriptive documentZie beschrijvend documentopenEB-OUT 6272UHV Sputter systemUHV Sputter systemThe MESA+ Institute will invest in a UHV Sputter system to replace the current UHV Sputter systems with a state-of-the-art system that will bring more advanced process control and better process conditions (by means of a UHV system) to the lab.  The system will be used for the deposition of metals onto various samples that have been processed in one or more deposition / lithography steps within the NanoLab facilities. Among these depositions, we outline a few below:  Deposition of Au layers for good electrical contact to electronic devices (typically combined with a Ti interlayer for improved adhesion of the deposited film).  Deposition of Nb layers for superconducting quantum devices such as Josephson junctions or SQUID devices (typically combined with a Pd capping layer). The system will furthermore enable users to etch the samples prior to the deposition, so that the surface of the sample can be cleaned to improve interface transparency in between the deposited layers and the ex-situ layers that have been prepared in other tools prior to loading the samples in the UHV Sputter system.  The MESA+ Institute will invest in a UHV Sputter system to replace the current UHV Sputter systems with a state-of-the-art system that will bring more advanced process control and better process conditions (by means of a UHV system) to the lab.  The system will be used for the deposition of metals onto various samples that have been processed in one or more deposition / lithography steps within the NanoLab facilities. Among these depositions, we outline a few below:  Deposition of Au layers for good electrical contact to electronic devices (typically combined with a Ti interlayer for improved adhesion of the deposited film).  Deposition of Nb layers for superconducting quantum devices such as Josephson junctions or SQUID devices (typically combined with a Pd capping layer). The system will furthermore enable users to etch the samples prior to the deposition, so that the surface of the sample can be cleaned to improve interface transparency in between the deposited layers and the ex-situ layers that have been prepared in other tools prior to loading the samples in the UHV Sputter system. supplies41500038000000Zie documentatieDelivery in the city of Enschedeanyw-couNLDLOT-0000ef-standZie beschrijvend documentSee descriptive documentusedsui-actn-usedtp-abiln-usedno-eu-fundsTender documentennon-restricted-documenthttps://s2c.mercell.com/today/80116nonerequirednonot-allowed30qualityWishesWishesSee descriptive documentSee descriptive document10pricePricePriceSee descriptive documentSee descriptive documenthttps://s2c.mercell.com/today/80116ORG-0002ENGNLDfalsetrueallowedfalse2024-05-14+00:0010:00:00+00:002024-04-26+02:0000:00:00+02:002024-05-15+02:0000:00:00+02:00falsenonenoneEB-OUT 6272UHV Sputter systemUHV Sputter systemThe MESA+ Institute will invest in a UHV Sputter system to replace the current UHV Sputter systems with a state-of-the-art system that will bring more advanced process control and better process conditions (by means of a UHV system) to the lab.  The system will be used for the deposition of metals onto various samples that have been processed in one or more deposition / lithography steps within the NanoLab facilities. Among these depositions, we outline a few below:  Deposition of Au layers for good electrical contact to electronic devices (typically combined with a Ti interlayer for improved adhesion of the deposited film).  Deposition of Nb layers for superconducting quantum devices such as Josephson junctions or SQUID devices (typically combined with a Pd capping layer). The system will furthermore enable users to etch the samples prior to the deposition, so that the surface of the sample can be cleaned to improve interface transparency in between the deposited layers and the ex-situ layers that have been prepared in other tools prior to loading the samples in the UHV Sputter system.  The MESA+ Institute will invest in a UHV Sputter system to replace the current UHV Sputter systems with a state-of-the-art system that will bring more advanced process control and better process conditions (by means of a UHV system) to the lab.  The system will be used for the deposition of metals onto various samples that have been processed in one or more deposition / lithography steps within the NanoLab facilities. Among these depositions, we outline a few below:  Deposition of Au layers for good electrical contact to electronic devices (typically combined with a Ti interlayer for improved adhesion of the deposited film).  Deposition of Nb layers for superconducting quantum devices such as Josephson junctions or SQUID devices (typically combined with a Pd capping layer). The system will furthermore enable users to etch the samples prior to the deposition, so that the surface of the sample can be cleaned to improve interface transparency in between the deposited layers and the ex-situ layers that have been prepared in other tools prior to loading the samples in the UHV Sputter system. supplies41500038000000Zie documentatieDelivery in the city of Enschedeanyw-couNLD