16 https://ec.europa.eu/info/departments/communications-networks-content-and-technology_en ORG-0001 European Commission, DG CNECT - Communications Networks, Content and Technology Rue de la Loi 200, Wetstraat 200 CNECT.C - Enabling and Emerging Technologies,CNECT.C.3 - Microelectronics and Photonics Brussels B-1049 BE100 BEL COM +32 2 299 11 11 cnect-tendering@ec.europa.eu http://curia.europa.eu ORG-0002 Court of Justice of the European Union Rue du Fort Niedergrünewald Luxembourg L-2925 LU000 LUX CURIA +352 4303-1 GC.Registry@curia.europa.eu https://commission.europa.eu/ ORG-0003 European Commission Mondrian (CDMA), Rue du Champ de Mars 21 Brussels B-1050 BE100 BEL EUCOM +32 2 299 11 11 cnect-tendering@ec.europa.eu 00234347-202571/20252025-04-10+02:00 2.3 eforms-sdk-1.10 e3384449-458a-497e-bbc9-53f732dbb06d 81fbee60-7306-43e7-96f7-1e7b2462add6 2025-04-09+02:00 10:03:02+02:00 01 32018R1046 cn-standard ENG eu-ins-bod-ag gen-pub ORG-0001 ted-esen ORG-0003 bankruptcy For the full list of exclusion grounds please consult the procurement documents. open EC-CNECT/2025/OP/0023 Measures to support the implementation of the EU Chips Act Pillar III To move forward with the implementation of the different tasks under the pillar III of the Chips Act and provide support to the European Semiconductor Board, we need to setup a service contract providing analytical, methodological and administrative support. The objectives of this procurement are to provide analytical, methodological and administrative support to the Commission, in order to implement the EU Chips Act pillar III. Objectives include developing a methodology to address the requirements regarding the strategic mapping, monitoring and crisis activation, defining in a more operational way the critical sectors and providing support during crisis, providing analytical support (including commercial data) for all policy files relative to the semiconductor value chain. The results will be used by the Commission and the European Semiconductor Board to fulfil the obligations stemming from the European Chips Act Pillar III. services In case of unavailability or disruptions in the functioning of the electronic means of communication provided in Section 5.1.11 in the last 5 calendar days before the time limit for receipt indicated in Section 5.1.12, the contracting authority reserves the right to extend this time limit and publish the extension at the Internet address provided in Section 5.1.11, without a preceding publication of a corrigendum to this notice. Economic operators interested in this procurement are invited to subscribe to the call for tenders at the address in Section 5.1.11 in order to get notified when new information or documents are published. true 1500000 73000000 LOT-0001 sui-act Please consult the procurement documents. ef-stand Please consult the procurement documents. tp-abil Please consult the procurement documents. eu-funds default-text non-restricted-document ENG official https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/tender-details/81fbee60-7306-43e7-96f7-1e7b2462add6-CN?#anchorDocuments none no allowed not-allowed per-exa 65 quality Please consult the procurement documents. per-exa 35 price Please consult the procurement documents. https://webgate.ec.europa.eu/digit/opsys/esubmission?cftUuid=81fbee60-7306-43e7-96f7-1e7b2462add6 6 ORG-0002 BUL CES DAN DEU ELL ENG SPA EST FIN FRA GLE HRV HUN ITA LIT LAV MLT NLD POL POR RON SLK SLV SWE false true Funding and Tenders Portal required false https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/tender-details/81fbee60-7306-43e7-96f7-1e7b2462add6-CN?#anchorDocuments 2025-05-19+02:00 16:00:59+02:00 2025-05-09+02:00 2025-05-20+02:00 10:00:00+02:00 false none none EC-CNECT/2025/OP/0023 Measures to support the implementation of the EU Chips Act Pillar III To move forward with the implementation of the different tasks under the pillar III of the Chips Act and provide support to the European Semiconductor Board, we need to setup a service contract providing analytical, methodological and administrative support. The objectives of this procurement are to provide analytical, methodological and administrative support to the Commission, in order to implement the EU Chips Act pillar III. Objectives include developing a methodology to address the requirements regarding the strategic mapping, monitoring and crisis activation, defining in a more operational way the critical sectors and providing support during crisis, providing analytical support (including commercial data) for all policy files relative to the semiconductor value chain. The results will be used by the Commission and the European Semiconductor Board to fulfil the obligations stemming from the European Chips Act Pillar III. services 1500000 73000000 36 provided they are in conformity with the basic project, new services or works consisting in the repetition of similar services or works, may be entrusted up to 50 % of the initial contract to the initial contractor by negotiated procedure without prior publication of a contract notice.